Die Casting for AI Data Center Liquid Cooling: Manifolds, CDUs, and the Parts It Should Not Make
In 2026 a single AI rack stopped being an air-cooling problem. Lenovo’s product guide for the NVIDIA GB300 NVL72 puts the rack at 135 kW TDP, up to 155 kW at peak, and splits heat capture roughly 90% to liquid and 10% to air. NVIDIA’s Vera Rubin generation goes further, running 45°C warm-water loops so







